Tiwei Wei

Tiwei Wei

ASSISTANT PROFESSOR
MECHANICAL AND AEROSPACE ENGINEERING

37-144, Eng IV

Email: tiwei32@ucla.edu
Phone: (650) 505-6084

Websites

RESEARCH AND INTERESTS
  • Heat Transfer in Advanced Semiconductor Interconnects & Packaging
  • Electronic Cooling & Efficient Thermal Packaging Materials
  • Thermal/Mechanical Simulation & Characterization
  • Materials, Processing & Architecture Development for Semiconductor Packaging
  • MEMS Fabrication for Extreme Heat Flux Microfluidic Cooling
  • Advanced Semiconductor Nanoscale 3D Interconnections
  • Novel Photonics & Quantum Packaging Technologies
  • Reliability Modeling & Characterization
NOTABLE PUBLICATIONS AND BOOKS
Google Scholar Page
IN THE NEWS
Tiwei Wei receives the ASME Electronic and Photonic Packaging Division (EPPD) Early Career Engineer
Tiwei Wei receives Intel's 2024 Rising Star Faculty Award
Tiwei Wei and team has received a total of $2.5 million from a Department of Energy grant to help make data centers more energy efficient
EDUCATION
  • Postdoc. Stanford University, '22
  • Ph.D. IMEC & KU Leuven, '20
AWARDS AND RECOGNITION
  • ASME Electronic and Photonic Packaging Division (EPPD) Early Career Engineer Award, 2025
  • ARPA-E COOLERCHIPS Award (PI), U.S. Department of Energy, 2024–2028 (~$2.5M)
  • IEEE EPS Regional Contributions Award, 2025
  • Intel Rising Star Faculty Award, 2024
  • Purdue Seed for Success Acorn Award, 2024
  • IEEE Senior Member, 2024
  • IMEC Ph.D. Excellence Award (3/200), 2020
  • FWO PhD Fellowship, 2019
  • IEEE EPS / ECTC Student Travel Award, 2019, 2024, 2025
  • IEEE ICEPT Outstanding Paper Award, 2013
Mentored students’ awards:
  • ASME InterPACK Nasser Grayeli Best Poster Award (Ye Yang), 2025
  • IEEE EPS / ECTC Student Travel Award (Ye Yang), 2025
  • IEEE EPS / ECTC Student Travel Award (Keyu Wang), 2024
  • IEEE REPP Best Student Poster Award (Keyu Wang), 2024
  • IEEE REPP Best Student Presentation Award (Shuhang Lyu), 2022
Journal services:
  • Associate Editor, Microelectronics Reliability, 2025-present
  • Lead Guest Editor, ASME Journal of Electronic Packaging (JEP), 2025-present
  • Associate Editor,  IEEE Transactions on Components, Packaging and Manufacturing Technology (CPMT), 2025-present
  • Nature 2025 (2x), Nature 2022 (1x), Nature 2020 (1x), Nature Communication (2x), Nature Nanotechnology (1x), Nano Letter (1x).
Conferences services:
  • General Chair (2024), Technical Program Chair (2023) and Session Chair (2022) for IEEE EPS REPP (Reliability for Electronics and Photonics Packaging)
  • Founder and Chair of IEEE EPS Central Indiana chapter, 2022-now
  • Chair for IEEE EPS Technical Committee on Reliability from June 2025-now.
  • Assistant Chair for IEEE ECTC Interconnections Committee from May 2025-now.
  • Vice Chair and Executive Committee for the IEEE-EPS Silicon Valley Area Chapter, 2019-2022