Tiwei Wei
ASSISTANT PROFESSOR (STARTING JULY 2025)
MECHANICAL AND AEROSPACE ENGINEERING
RESEARCH AND INTERESTS
- Heat Transfer in Advanced Semiconductor Interconnects & Packaging
- Electronic Cooling & Efficient Thermal Packaging Materials
- Thermal/Mechanical Simulation & Characterization
- Materials, Processing & Architecture Development for Semiconductor Packaging
- MEMS Fabrication for Extreme Heat Flux Microfluidic Cooling
- Advanced Semiconductor Nanoscale 3D Interconnections
- Novel Photonics & Quantum Packaging Technologies
- Reliability Modeling & Characterization
NOTABLE PUBLICATIONS
EDUCATION
- Postdoc. Stanford University, '22
- Ph.D. IMEC & KU Leuven, '20
- Researcher: Tsinghua University, '14; HKUST, '15
- M.S. Joint CQUPT and Tsinghua University, '12
AWARDS AND RECOGNITION
- 2024 Intel Rising Star Faculty Award
- IEEE Senior Member, 2024
- IMEC Ph.D. Excellence Award (3/200), 2020
- IEEE EPS / ECTC Student Travel Award, 2019, 2024
- IEEE REPP Best Student Presentation Award, 2022
- IEEE ICEPT Outstanding Paper Award, 2013
- General Chair (2024), Technical Program Chair (2023) and Session Chair (2022) for IEEE EPS REPP (Reliability for Electronics and Photonics Packaging)
- Founder and Chair of IEEE EPS Central Indiana chapter, 2022-now
- Vice Chair and Executive Committee for the IEEE-EPS Silicon Valley Area Chapter, 2019-2022
- Track Chair at ASME K-16's Summer Heat Transfer Conference in 2023 and 2024
- Track Co-Chair for Interactive Presentations session at ASME InterPACK 2023 and 2024
- Track Co-Chair for “MECHANICS AND RELIABILITY” at IEEE ITherm 2025